Huawei is reportedly working on a new chipset designed using a new packaging technology. It has also been tipped that the preparations for Huawei Mate X3 foldable smartphone will begin in a couple of days.
from Gadgets 360 https://ift.tt/nodxKck
Post Top Ad
Responsive Ads Here
Wednesday, February 1, 2023
Home
Gadgets 360
Huawei Tipped to Announce a New Chipset Based on New Packaging Technology This Year
Huawei Tipped to Announce a New Chipset Based on New Packaging Technology This Year
Tags
# Gadgets 360
Share This
About World News
Gadgets 360
Tags
Gadgets 360
Subscribe to:
Post Comments (Atom)
Post Bottom Ad
Responsive Ads Here
No comments:
Post a Comment